|
Adhesive Type |
Typical Chemistry |
Strength Direction |
Temperature / Environment |
Cure Direction |
Typical Motor Use |
Key Risk |
|
Structural Epoxy |
One-part heat cure or two-part epoxy |
High shear and structural strength |
Good heat and chemical resistance depending on grade |
Room temperature or heat cure |
Magnet bonding, rotor bonding, stator parts, metal-to-metal assembly |
Surface prep, cure profile, brittleness, thermal expansion mismatch |
|
Toughened Epoxy |
Rubber-toughened or modified epoxy |
High strength with better impact resistance |
Good thermal cycling resistance |
Often two-part or heat cure |
Rotor magnets, vibration-exposed bonded parts, high reliability assemblies |
Viscosity, fixture time, cure shrinkage and process repeatability |
|
Acrylic Adhesive |
MMA / structural acrylic |
Medium to high strength, fast handling |
Moderate to good depending on grade |
Fast two-part cure or activator system |
Fast magnet fixing, metal bonding, production line bonding |
Odor, exotherm, gap control, aging and temperature limit |
|
Anaerobic Threadlocker |
Methacrylate anaerobic adhesive |
Thread locking and vibration resistance |
Good oil resistance after cure, grade dependent heat resistance |
Cures between metal surfaces without oxygen |
Screws, threaded joints, retaining bolts, anti-loosening |
Plastic compatibility, inactive metals, large gaps, disassembly torque |
|
Anaerobic Retaining Compound |
High-strength anaerobic retaining adhesive |
High retaining strength for cylindrical fits |
Good for bearings and sleeves after cure |
Cures in close metal gaps |
Bearings, sleeves, shafts, press-fit reinforcement |
Gap size, surface oil, cure speed, serviceability |
|
Silicone Adhesive / Sealant |
RTV silicone, addition cure silicone |
Flexible, lower structural strength |
Good temperature cycling and moisture resistance |
Moisture cure, heat cure or two-part |
Sealing, sensor fixing, electronics protection, vibration damping |
Low strength, cure inhibition, adhesion on some substrates |
|
Polyurethane Adhesive / Potting |
Two-part PU or reactive polyurethane |
Flexible and tough |
Good damping, grade dependent heat and chemical resistance |
Two-part cure, moisture-sensitive process |
Cable sealing, potting, low-stress encapsulation, vibration control |
Moisture bubbles, hydrolysis, temperature limit |
|
Thermally Conductive Adhesive |
Filled epoxy, silicone or acrylic |
Medium to high depending on base chemistry |
Designed for heat transfer and insulation |
Room temperature or heat cure |
Heat sinks, sensors, PCB fixing, stator thermal paths |
High viscosity, bondline thickness, filler settling, thermal stress |
|
Potting / Encapsulation Resin |
Epoxy, silicone, polyurethane |
Protective rather than structural |
Selected by heat, moisture, chemical and vibration needs |
Meter-mix, vacuum potting, heat or room cure |
Stator encapsulation, electronics protection, coil potting |
Voids, exotherm, cracking, rework difficulty, thermal expansion mismatch |